Electrical potting

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In electronics, potting is a process of filling a complete electronic assembly with a liquid compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. In earlier times potting was often used to discourage reverse engineering of proprietary products built as printed circuit modules. It is also commonly used in high voltage products to allow live parts to be placed much closer together, so that the product can be smaller; also, to keep dirt and conductive contaminants such as impure water out of sensitive areas. Potting can be rigid or soft. When void-free potting is required, it's common practice to place the product in a vacuum chamber while the resin is still liquid, hold a vacuum for several minutes to draw the air out of internal cavities and the resin itself, and then release the vacuum. 

RE33/HE33 is a flexible polyether polyol clear casting system that is used for the encapsulation of electrical components. This product is flexible but can be extracted from the...

Max Use Temp:
70 °C

 Casting resin for mechanical and numerous electrical applications especially for low or medium voltage.  Example: potting electronic cards and components.

Max Use Temp:
120°C

 Casting resin for mechanical and numerous electrical applications especially for low or medium voltage.  Example:  transformers, inductive elements, electronic cards and components.

Max Use Temp:
120°C